Many are asking themselves if compared to the BGA versus Lga Stencil is a challenge and the truth is that many people on the internet are saying that it quite is. When having the solder balls on a BGA, the component will have to be lifted above the board, which means that during the soldering process, gasses will escape. However, when it comes to using an Lga Stencil, the component pads will be placed directly in the solder paste, which means that there will be a very small space left for outgassing.
Those who have tried using Lga Stencil have already noticed that the results they have gotten have been greatly voiding on the solder visits, which are quite visible under X-ray. While the voiding fell under normal standards, it was also expected by the component manufacturer. However, people are saying that from a quality perspective, it just didn’t sit well for them. One person has used a voltage regulator as a component and he was quite worried about the component’s operation considering the solder voids that were very clearly shown at the X-ray scan.
As everyone has noted so far, it seems that voids are the main issue. However, in an effort to chase down the voids, the process can be changed a little bit, likely numerous times in the course of reducing a few percentage points. So if the manufacturer of the Lga Stencil will state that the device is going to perform alright within parameters with a certain voiding percentage of no greater than a certain value, then people will just have to go with it. In such cases, it seems that the documentation offered by the manufacturer is very important. With that being said, these are the main things you’ll need to know about Lga Stencil, so good luck with your projects.